| 000 | 01041nam a2200277zi 4500 | ||
|---|---|---|---|
| 005 | 20200318103745.0 | ||
| 008 | 120316s2010 xxua 000 0 eng | ||
| 020 | _a9781606501870 (empastado, cubierta dura : en estuche) | ||
| 020 | _a1-60650-187-9 (empastado, cubierta dura : en estuche) | ||
| 035 | _aMX001001495401 | ||
| 040 |
_aDLC _bspa _cDLC _dDLC _dUNAMX |
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| 050 | 0 |
_aTK7870.15 _bC43 2010 |
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| 082 | 0 | 0 |
_a621.381/046 _220 |
| 245 | 0 | 0 |
_aCharacterization of integrated circuit packaging materials / _ceditors, Thomas M. Moore and Robert G. McKenna |
| 264 | 1 |
_aNew York : _bMomentum Books, _c2010 |
|
| 300 |
_axx, 274 páginas : _bilustraciones |
||
| 490 | 0 | _aMaterials characterization series | |
| 650 | 0 |
_aEncapsulado electrónico _xMateriales |
|
| 650 | 0 |
_aCircuitos integrados _xDiseño y construcción |
|
| 700 | 1 |
_aMoore, Thomas M., _eeditor |
|
| 700 | 1 |
_aMcKenna, Robert G., _eeditor |
|
| 336 |
_atexto _2rdacontent |
||
| 337 |
_asin medio _2rdamedia |
||
| 338 |
_avolumen _2rdacarrier |
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| 999 |
_c2743 _d2743 |
||