Polymeric materials for electronics packaging and interconnection /
Polymeric materials for electronics packaging and interconnection /
John h. lupinski, ed., Robert s. Moore, ed.
- 499 páginas
- ACS symposium series ; 407 .
"developed from a symposium sponsored by the divisions of polymeric materials : science and enginering and polymer chemistry, inc., at the 196th national meeting of the american chemical society, los angeles california, september 25-30, 1988"
0841216797
Encapsulado electrónico--Materiales--Congresos
Polímeros--Congresos
TK7870 / P65
"developed from a symposium sponsored by the divisions of polymeric materials : science and enginering and polymer chemistry, inc., at the 196th national meeting of the american chemical society, los angeles california, september 25-30, 1988"
0841216797
Encapsulado electrónico--Materiales--Congresos
Polímeros--Congresos
TK7870 / P65