Ceramic substrates and packages for electronic applications / Ed. by man f. yan... [y otros.]
Material type:
TextSeries: Advances in ceramics ; v. 26Publisher: Westerville : American ceramic society, c1989Description: 608 páginasContent type: texto Media type: sin medio Carrier type: volumenISBN: 0916094350Subject(s): Encapsulado electrónico -- Congresos | Cerámica electrónica -- CongresosLOC classification: TK7871.15C4 | I57
| Item type | Current library | Collection | Call number | Copy number | Status | Date due | Barcode | Item holds |
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Libros
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División de Estudios de Posgrado. Libros Libros | General | TK7871.15C4 I57 (Browse shelf(Opens below)) | 1 | Available | 4762 |
Total holds: 0
"proceedings of the international symposium on ceramic substrates and packages, sponsored by the electronics division of the american society and the ceramic society of japan, held in denver, co on october 18-21, 1987" --al reverso de
la portada
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