Polymeric materials for electronics packaging and interconnection / John h. lupinski, ed., Robert s. Moore, ed.
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División de Estudios de Posgrado. Libros Libros | General | TK7870 P65 (Browse shelf(Opens below)) | 1 | Available | 5158 |
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TK6553 W47 2001 Electromagnetic compátibility : | TK7815 M24 Electronics for scientists principles and experiments for those who use instruments | TK7836 M33 2002 Fundamentals of microfabrication : | TK7870 P65 Polymeric materials for electronics packaging and interconnection / | TK7871 A77 1988 Atomic scale calculations in materials science : | TK7871.15 P65 Polymers in microlithography : | TK7871.15C4 G73 Grain boundary phenomena in electronics ceramics / |
"developed from a symposium sponsored by the divisions of polymeric materials : science and enginering and polymer chemistry, inc., at the 196th national meeting of the american chemical society, los angeles california, september 25-30,
1988"
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