TY  - BOOK
AU  - Lupinski, John H.
AU  - Moore, Robert S.
ED  - American Chemical Society.
ED  - American Chemical Society.
TI  - Polymeric materials for electronics packaging and interconnection
T2  - ACS symposium series
SN  - 0841216797
AV  - TK7870 P65
PY  - 1989///
CY  - Washington, D.C.
PB  - American Chemical Society
KW  - Encapsulado electrónico
KW  - Materiales
KW  - Congresos
KW  - Polímeros
N1  - "developed from a symposium sponsored by the divisions of polymeric materials : science and enginering and polymer chemistry, inc., at the 196th national meeting of the american chemical society, los angeles california, september 25-30; 1988"
ER  -