Polymeric materials for electronics packaging and interconnection / John h. lupinski, ed., Robert s. Moore, ed.
Material type: TextSeries: ACS symposium series ; 407Publisher: Washington, D.C. : American Chemical Society, 1989Publisher: Washington, D.C. : American Chemical Society, 1989Description: 499 páginasContent type: texto Media type: sin medio Carrier type: volumenISBN: 0841216797Subject(s): Encapsulado electrónico -- Materiales -- Congresos | Polímeros -- CongresosLOC classification: TK7870 | P65Item type | Current library | Collection | Call number | Copy number | Status | Date due | Barcode | Item holds |
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Libros | División de Estudios de Posgrado. Libros Libros | General | TK7870 P65 (Browse shelf(Opens below)) | 1 | Available | 5158 |
"developed from a symposium sponsored by the divisions of polymeric materials : science and enginering and polymer chemistry, inc., at the 196th national meeting of the american chemical society, los angeles california, september 25-30,
1988"
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